Material & Components hmasawn tak tak siamna atana Laser Cutting Solution dik tak
HTLaser hian ceramic substrate, thin film, metal, non-metal material, leh complex three{1}}dimensional components te tan laser cutting solution a pe a ni.
Application chungchang tlangpui
Laser cutting hian focused laser beam hmangin programmed path-a thil awmte chu a thliar hrang emaw, a paih chhuak emaw a ni. Non-contact process angin laser cutting hian mechanical cutting tools tel lovin geometries complex leh material nalh tak tak a handle thei a ni.
HTLaser hian precision material processing atanga 3D leh robotic laser cutting thlengin specialized solution a pe a ni.
Processing lama harsatna awmte
Tunlai thil siamtute chuan hetiang hian an process a ngai zual sauh sauh a ni:
Thil brittle emaw, sensitive emaw a ni
Film te tak te leh thil nalh tak tak te
3D components complex tak tak a awm
Geometries tenau leh inzawmkhawm tak tak
Thil chi hrang hrang, cutting edge fai mamawh
Volume sang tak tak siam chhuahna components
Mechanical cutting hian complex shape leh delicate materials process-naah physical stress, tool wear, burrs, chipping, emaw limitation a thlen thei a ni.
Laser Solution a thatna te
Non-Contact Processing a ni lo
Laser cutting hian direct mechanical contact awm lovin hna a thawk a, tool wear leh mechanical stress a tihziaawm.
Geometry hmanga thil tih theihna complex tak
Multi-axis leh robotic system te hian pattern inthup tak tak leh three{1}}dimensional components te chu an process thei a ni.
Digital Processing pawh a inthlak danglam thei
Cutting paths hi digital-in mechanical tooling thlak danglam lovin a thlak theih a ni.
Thil siamna atana hmanraw bik (Specialized Material Processing) a ni
Ceramic, film, metal, leh thil dang atan laser source leh configuration hrang hrang thlan theih a ni.
Laser hmanga Cutting hman dan
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Dilna |
Thil hman tur |
Industry hrang hrangte |
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Ceramic Substrate hmanga tihfai a ni |
Ceramic substrate leh electronic material brittle te a awm bawk |
Semiconductor, electronics, power electronics te a ni |
|
Thin Film & Functional Material hmanga siam chhuah a ni |
Film te tak te, thil flexible tak tak, leh film functional tak tak te |
Electronics, display, semiconductor siamna lam a ni |
|
3D Component Cutting a ni |
Metal tube, formed parts, structure rit lo tak tak te |
Automotive, battery, industry lama thil siam chhuah te a ni |
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Metal Cutting dik tak a ni |
Stainless steel, carbon steel, aluminium, leh thir dangte |
Thil siam dan dik tak, electronics, motor siamna |
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Advanced Material Cutting tih a ni |
Composite, glass, polymer, leh lumna-sensitive thil te |
Material hmasawn tak tak, high-tech siamna |
Machine hmanraw tha tak tak te
Ceramic Substrate Laser hmanga siam chhuahna hmanrua
Ceramic substrate leh electronic material hmasawn tak takte precision cutting atana siam a ni.
Thin Film Laser hmanga cutting Machine hmanga siam a ni
Thin film leh functional materials te precision processing atan.
3D 5-Axis Laser hmanga tihtlakna hmanrua
Complex three{0}}dimensional components tan chuan multi-axis cutting mamawh a ni.
3D Robotic Laser hmanga siam chhuahna hmanrua
Robot processing flexible leh automated 3D cutting application atan.
A tenau-A zau zawnga Metal Laser Cutter
Small-format metal components remchang tak tak precision cutting atan.